| Product |
Character |
Application |
| CA-HP-02 |
High purity
2% citric acid soln. |
Additive for cleaning soln.
Cleaning soln for metal
impurities
Wafer fabrication process
Wafer reclaim process |
| CA-HP-10 |
High purity
10% citric soln. |
| CA-HP-30 |
High purity
30% citric soln. |
| WCA-30S |
High wettability & purity
30% citric soln. |
| CIREX |
High metal removability
And high purity citric acid soln. of different additive concentrations |
Cleaning soln for metal impurities
Post Al-CMP cleaning soln.
Post W-CMP cleaning soln. |
| CIREX-C15 |
| CLEAN-100 |
High wettability, high metal removability and high purity citic acid soln. of different concentrations and types of additive |
One-step cleaning soln. for metal impurities and particles
Post Cu-CMP cleaning soln.
Post Cu/low-k CMP claening |
| CAX-200 |
| CLEAN-200LK |
| CLEAN-300LK |
WCP-1000
(acid type) |
High performance
Cleaning soln. of different pH values |
Cleaning soln. for defects
Post Cu/low-k CMP cleaning |
WCP-2000
(alkaline type) |